System & Advanced Packaging Design Lead is open at Phizenix in Santa Clara, CA (Hybrid). The posting gives a salary of $180K - $200K. Posted on Oct 12, 2026, and still on Phizenix’s careers page when we last checked, on Nov 14, 2026.
About the role
We are seeking an Advanced 2.5D/3D/Chiplet packaging Lead, who will be directing Signal Integrity for Package, PCB and System design for Copper Interconnects beyond 200G, Work on enabling advanced packaging for Driver, TIA & Optics for AI Scale up engine including SI/ PI, Reliability, Thermals and HVM; Also drive Micro-LED packaging and Heterogeneous package development. Good understanding of OSAT ecosystem and…
The opening lines of the posting. The rest is on Phizenix’s careers page.
Hiring at Phizenix
Phizenix has 14 open roles right now, 8 of them remote. Most are in Engineering, Sales & Business Development and Product. See all its roles
