Senior/Staff Process Engineer (Wafer Dicing & Back-grind) is open at Lumilens in Singapore. Posted on Oct 13, 2026, and still on Lumilens’s careers page when we last checked, on Nov 15, 2026.
About the role
Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line. - Optimize wafer thinning thickness, grinding speed, cutting path and laser cutting parameters to avoid chip crack, edge chipping and optical structure damage of silicon photonic wafers. - Solve process abnormalities in wafer…
The opening lines of the posting. The rest is on Lumilens’s careers page.
Hiring at Lumilens
Lumilens has 163 open roles right now. Most are in Engineering, Supply Chain & Logistics and Manufacturing & Trades. See all its roles
