Senior IC Packaging Designer is open at Falcomm in Atlanta, Georgia, United States. The posting gives no salary; similar roles in the United States advertise a median of $170K. Posted on Mar 12, 2026, and still on Falcomm’s careers page when we last checked, on Nov 15, 2026.
About the role
Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages. Create package layouts, bond diagrams, and substrate routing using semiconductor packaging EDA tools. Work with signal integrity, EM, and thermal simulation teams to validate package performance. Generate package documentation, fabrication drawings, and assembly…
The opening lines of the posting. The rest is on Falcomm’s careers page.
Hiring at Falcomm
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