Principal Package Engineer is open at Delos Data in Palo Alto (hybrid). The posting gives a salary of $180K - $270K. Posted on Oct 1, 2026, and still on Delos Data’s careers page when we last checked, on Nov 14, 2026.
About the role
Select and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability. - Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints. - Define substrate stack‑ups, bump pitch, ball pitch, routing, via structures, and material choices for performance and…
The opening lines of the posting. The rest is on Delos Data’s careers page.
Hiring at Delos Data
Delos Data has 15 open roles right now, 6 of them remote. Most are in Engineering. See all its roles
