Home / Engineering / Principal ASIC Package Design Engineer

Principal ASIC Package Design Engineer

K2 Space · Seattle, WA
$200K - $280KParental leaveLead

Principal ASIC Package Design Engineer is open at K2 Space in Seattle, WA. The posting gives a salary of $200K - $280K. Posted on Sep 15, 2026, and still on K2 Space’s careers page when we last checked, on Nov 14, 2026.

About the role

We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions. This role owns the end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp. You will operate…

The opening lines of the posting. The rest is on K2 Space’s careers page.

Hiring at K2 Space

K2 Space has 244 open roles right now, 11 of them remote. Most are in Engineering, Manufacturing & Trades and Operations. The median advertised salary across its roles with a published range is $165K. See all its roles

Similar Engineering jobs

All Engineering jobs
Apply on company site