Director, System in Package Architecture is open at SK hynix America in San Jose, CA. The posting gives a salary of $240K - $300K. Posted on Jul 6, 2026, and still on SK hynix America’s careers page when we last checked, on Nov 14, 2026.
About the role
Lead the end-to-end development of advanced packaging system architectures to maximize System in Package (SiP) performance, with a specific focus on High Bandwidth Memory (HBM). Drive mechanical and electrical test vehicle design and development when necessary. Spearhead research and development of novel technologies to enhance SiP performance, driving the roadmap for SOC and HBM integration in 2.5D and 3D packaging…
The opening lines of the posting. The rest is on SK hynix America’s careers page.
Hiring at SK hynix America
SK hynix America has 48 open roles right now. Most are in Engineering, Sales & Business Development and Finance & Trading. The median advertised salary across its roles with a published range is $148K. See all its roles
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