Advanced Packaging Lead is open at Quantware in Delft. Posted on Oct 23, 2026, and still on Quantware’s careers page when we last checked, on Nov 14, 2026.
About the role
Plan and lead the development of back-end fabrication and assembly technologies, with a focus on enhancing the flip chip bonding techniques, contacts reliability, and manufacturability of quantum processors to our architecture chip stack. - Develop and coordinate integration test plans in collaboration with cross-functional teams. - Lead the definition and formalisation of assembly-centric fabrication and process…
The opening lines of the posting. The rest is on Quantware’s careers page.
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