Advanced Packaging & Integration Lead is open at Equal1 in Dublin (hybrid). Posted on Sep 21, 2026, and still on Equal1’s careers page when we last checked, on Nov 15, 2026.
About the role
, you will work with a multidisciplinary team to drive the R&D of complex multi-chip modules utilising TSVs and micro-bumps, optimised for operation at millikelvin temperatures. You will have a significant influence on the physical architecture of next-generation quantum processors, shaping how advanced packaging subsystems integrate into the overall quantum computing solution. MAIN DUTIES AND RESPONSIBILITIES -…
The opening lines of the posting. The rest is on Equal1’s careers page.
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