3D Packaging Engineer is open at Quantware in Delft. Posted on Oct 27, 2026, and still on Quantware’s careers page when we last checked, on Nov 14, 2026.
About the role
Tooling Adaptation: Assist in modifying and calibrating high-precision assembly equipment (e.g., flip-chip bonders, die attach machines) to meet unique quantum 3D integration specifications. - Process Optimization: Help develop and refine placement and bonding processes (thermo-compression bonding, laser-assisted bonding, coldwelding) for non-standard substrates. Test adhesives, glues, and solders to determine which…
The opening lines of the posting. The rest is on Quantware’s careers page.
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